Title:
PRODUCTION OF MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH0677663
Kind Code:
A
Abstract:
PURPOSE: To realize high density multilayer board while increasing freedom in the design of circuit pattern by reducing the number of gold plated leads required for formation of a gold plated layer in an interstitial via hole.
CONSTITUTION: After drilling a prepreg 4 interposed between a set of interstitial via holes(IVH), the pair of IVHs 6 are connected electrically through plating. A plating lead is led out from an outer layer pattern 9 connected with one of the pair of IVHs 6 and subjected to gold plating. Subsequently, the prepreg 4 on the inside of the IVH 6 is drilled with a diameter larger than the hole 7 but smaller than the IVH 6 thus removing the plated lead connecting the IVH 6.
Inventors:
ONOKI TOSHIHIKO
NOHARA TORU
NOHARA TORU
Application Number:
JP23040892A
Publication Date:
March 18, 1994
Filing Date:
August 28, 1992
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K3/46; (IPC1-7): H05K3/46
Attorney, Agent or Firm:
Hironobu Onda