Title:
【発明の名称】半導体部品製造用短冊状リードフレームの間欠移送装置
Document Type and Number:
Japanese Patent JP2800950
Kind Code:
B2
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Inventors:
Hideshi Nagata
Nobuyuki Nakamura
Fuji Kazunori
Nobuyuki Nakamura
Fuji Kazunori
Application Number:
JP27490790A
Publication Date:
September 21, 1998
Filing Date:
October 12, 1990
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
B65H5/16; B65G25/04; H01L21/50; (IPC1-7): B65G25/04; H01L21/50
Domestic Patent References:
JP5866341A | ||||
JP2121340A | ||||
JP6058626A | ||||
JP49104568A |
Attorney, Agent or Firm:
Akio Ishii (1 person outside)