Title:
【発明の名称】BGA半導体パッケージの製造方法
Document Type and Number:
Japanese Patent JP2882784
Kind Code:
B2
Abstract:
A BGA package and a fabrication method therefor are capable of enhancing the productivity of an assembly by eliminating a wire bonding step, which requires a significant amount of time. The package includes a semiconductor chip, connection balls attached to upper surfaces of each of a plurality of chip pads formed on an upper surface of the semiconductor chip, a molding section that exposes upper portions of the connection balls and that packages at least a portion of the semiconductor chip, and solder balls attached to the exposed surfaces of the connection balls. A BGA package embodying the invention is lighter and more compact than related BGA packages. Also, because a wire bonding process is not necessary, it is less expensive to manufacture a BGA package embodying the invention.
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Inventors:
CHO ZAIGEN
Application Number:
JP226398A
Publication Date:
April 12, 1999
Filing Date:
January 08, 1998
Export Citation:
Assignee:
ERU JII SEMIKON CO LTD
International Classes:
H01L21/60; H01L23/12; H01L23/28; H01L23/31; (IPC1-7): H01L23/12; H01L21/60
Domestic Patent References:
| JP964049A | ||||
| JP969586A | ||||
| JP9213830A | ||||
| JP837253A |
Attorney, Agent or Firm:
Hajime Tsukuni (3 outside)