Title:
【発明の名称】電子パッケージ用の空洞および隆起部相互接続構造
Document Type and Number:
Japanese Patent JP2825772
Kind Code:
B2
Abstract:
Electronic interconnection of two printed wiring structures. Two printed wiring boards (11, 16) or a flexprint circuit (20) and a printed wiring board (11) are interconnected by creating a plated hole pattern (12) on a surface (12) of the printed wiring board (11), and wherein holes (13) of the pattern (12) have a concave cross section. The holes (13) of the plated hole pattern (12) are mated with corresponding bumps (17) or dimples (17) disposed on the second printed wiring board (16) or the flexprint circuit (20). The holes (13) formed in the first printed wiring board (11) are disposed a predetermined depth below a surface (18) of the printed wiring board (11), typically to a depth of between 0.007 inches and 0.020 inches below the surface. The plurality of plated holes (13) are formed by electroless plating or electroplating of the holes (13). The present interconnection structure (10) provides for reliable and self aligning interconnection of the two printed wiring boards (11, 16) or the flexprint circuit (20) and printed wiring board (11).
Inventors:
MOHI SOBUHANI
Application Number:
JP31381894A
Publication Date:
November 18, 1998
Filing Date:
December 16, 1994
Export Citation:
Assignee:
EICHI II HOORUDEINGUSU INC DEII BII EE HYUUZU EREKUTORONIKUSU
International Classes:
H01R12/50; H01R12/52; H01R12/62; H05K1/11; H05K1/14; H05K3/36; H05K3/40; (IPC1-7): H05K1/14; H01R9/09
Domestic Patent References:
| JP5267811A | ||||
| JP4142095A | ||||
| JP467379U |
Attorney, Agent or Firm:
Takehiko Suzue