Title:
【発明の名称】リードフレームのモールド装置
Document Type and Number:
Japanese Patent JP2807042
Kind Code:
B2
Inventors:
Kazuhisa Hasegawa
Application Number:
JP13049090A
Publication Date:
September 30, 1998
Filing Date:
May 21, 1990
Export Citation:
Assignee:
Apic Yamada Corporation
International Classes:
H01L21/56; (IPC1-7): H01L21/56
Domestic Patent References:
| JP61215023A | ||||
| JP62269329A | ||||
| JP61118706U |
Attorney, Agent or Firm:
Takao Watanuki (1 outside)