Title:
JOINT STRUCTURE AND METHOD BETWEEN AMORPHOUS FIBER AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH0722726
Kind Code:
A
Abstract:
PURPOSE: To provide a joint structure and method between amorphous fiber and a printed wiring board which achieves a firm joint with a simple operation and also has an improved electrical connection reliability at the joint part with a simple structure and method.
CONSTITUTION: In the joint structure of amorphous fiber 10 and a printed wiring board 20 where the amorphous fiber 10 with Fe-Co as a main constituent is joined to a connection terminal 21 which is formed at the printed wiring board 20, a plating 11 formed on the amorphous fiber 10 and solder 30 for joining the plating 11 of the amorphous fiber 10 and the connection terminal 21 of the printed wiring board 20 are provided.
Inventors:
KAWASAKI YOGO
Application Number:
JP16108293A
Publication Date:
January 24, 1995
Filing Date:
June 30, 1993
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K1/18; H05K3/34; (IPC1-7): H05K1/18
Attorney, Agent or Firm:
Hironori Takenori
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