PURPOSE: To prevent production of dust due to contact in the succeeding process of development, breaking of a substrate and fault of a cell gap in the assembling process of cells, deposition of dust due to chipping of a protective film near cutting lines by removing a swollen part on the circumference and a spread part on the back surface of a photosetting resin protective film and a part of the protective film on the cutting line for chips.
CONSTITUTION: Color picture elements 2 of several colors are arranged on a transparent substrate 1, and a transparent resin protective film 3 is formed on the color picture elements 2. After the photosetting transparent resin or its soln. for the protective film 3 is applied on the whole surface of the substrate 1, the resin is exposed for photosetting using a mask to cut light so that the protective film 3a on the circumference, protective film 3b on the side face, and the protective film 3c spread on the back surface are not cured. The uncured area is dissolved and removed during development. Thus, the swollen part of the protective film 3 on the circumference and spread part of the protective film 3 on the back surface of the substrate 1 can be dissolved and removed at the time of development. By this method, effects to prevent production of dust in the succeeding process and to remove the swollen film on the circumference are obtd. as well as breaking of the substrate in the assembling process of cells can be decreased.
NISHIMOTO TAKASHI
ISHIDA TAKEHIKO
