Title:
【発明の名称】ポリウレタンパッドの工程特性値予測方法および装置
Document Type and Number:
Japanese Patent JP3203254
Kind Code:
B2
Abstract:
A measurement of polyurethane pad characteristics is used to predict performance characteristics of polyurethane pads used for chemical mechanical planarization (CMP) of semiconductor wafers, and to adjust process parameters for manufacturing polyurethane pads. In-situ fluorescence measurements of a pad that has been exposed to a high pH and high temperature environment are performed. The fluorescence characteristics of the pad are used to predict the rate of planarization of a wafer. A portion of one pad from a manufacturing lot is soaked in an organic solvent which causes the portion to swell. The relative increase in size is indicative of the performance characteristics of pads within the manufacturing lot. Statistical Process Control methods are used to optimize the CMP pad manufacturing process. Predicted pad characteristics are available for each pad.
More Like This:
Inventors:
Maykel, Scott G.
Hudson, Guyev.
Hudson, Guyev.
Application Number:
JP52428596A
Publication Date:
August 27, 2001
Filing Date:
January 30, 1996
Export Citation:
Assignee:
Micron Technology, Inc.
International Classes:
G01N21/64; B24B37/24; B24B49/12; B24B53/007; B24B53/017; B24D18/00; H01L21/304; (IPC1-7): B24B37/00; G01N21/64; H01L21/304
Domestic Patent References:
| JP7260688A | ||||
| JP75049U | ||||
| JP62503120A |
Attorney, Agent or Firm:
Atsushi Nakajima (2 outside)