Title:
【発明の名称】III-V族化合物半導体結晶の切断方法
Document Type and Number:
Japanese Patent JP2842307
Kind Code:
B2
Inventors:
NISHIURA TAKAYUKI
OOYAMA YOSHINOBU
OOYAMA YOSHINOBU
Application Number:
JP18773095A
Publication Date:
January 06, 1999
Filing Date:
June 30, 1995
Export Citation:
Assignee:
SUMITOMO DENKI KOGYO KK
International Classes:
B24B47/22; B23D57/00; B24B27/06; H01L21/304; (IPC1-7): H01L21/304; B24B27/06; B24B47/22
Attorney, Agent or Firm:
Shigeki Kawase