Title:
【発明の名称】金型クリーニング装置及び金型クリーニング方法
Document Type and Number:
Japanese Patent JP2904124
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a device and method for cleaning a mold capable of achieving the miniaturization of the device in a simple structure and, at the same time, capable of improving the maintenance and reducing manufacturing cost. SOLUTION: The device is provided with a mold 11 including an upper mold 9 and a lower mold 10, resin molded item conveying means 5 for taking up an resin molded item 12 from the inside of the mold 11 and conveying it outside the mold 11, and cleaning means 6 for cleaning the resin molded faces S1 and/or S2 in a manner that it engages with the resin molded item conveying means 5 and comes in contact with the resin molded faces S1 and/or S2 of at least one mold part of the upper mold 9 and lower mold 10 of the mold 11 at the delivery operation period of the molded item conveying means 5 for delivering the resin molded item 12.
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Inventors:
YANAI MITSUHIRO
PPONDO YUKINORI
PPONDO YUKINORI
Application Number:
JP15361396A
Publication Date:
June 14, 1999
Filing Date:
June 14, 1996
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
B21D37/00; B29C33/44; B29C33/72; B29C45/14; H01L21/56; B29C37/00; B29L31/34; (IPC1-7): B29C33/72; B29C33/44
Domestic Patent References:
| JP4241912A | ||||
| JP58157620U |
Attorney, Agent or Firm:
Yasuyuki Hata