Title:
【発明の名称】再湿型接着剤としてのポリアミド
Document Type and Number:
Japanese Patent JPH10507783
Kind Code:
A
Abstract:
The present invention is a novel remoistenable adhesive and an improvement in the bonding method for an envelope, a stamp, a sticker, a packaging tape or a label using a remoistenable adhesive, wherein the remoistenable adhesive is a hot melt consisting of a thermoplastic polyamide prepared from an acid component selected from the group consisting of adipic acid, pimelic acid, azelaic acid, suberic acid and sebacic acid, and an alkyleneoxy diamine component consisting of one or more diamine compounds having the formula: H2N-CyH2y-(OC2H4)x-O-CyH2y-NH2 where y is 2 or 3 and x is 1-50.
Inventors:
Ahmed, Scharf, You.
Application Number:
JP51015096A
Publication Date:
July 28, 1998
Filing Date:
January 05, 1995
Export Citation:
Assignee:
H.B.FULLER LICENSINGAND FINANCING INCORPORATED
International Classes:
C08G69/40; C09J5/00; C09J7/21; C09J7/30; C09J177/06; G09F3/10; (IPC1-7): C09J177/06; C09J5/00; C09J7/02; G09F3/10
Attorney, Agent or Firm:
Asao Kamoda (1 person outside)