PURPOSE: To improve airtightness and to prevent contamination from the air by providing a seal groove to a case of a box body of a semiconductor wafer packing container for fittingly inserting a gasket and by fitting the case of the box body and a lid body by four clips and clip recessed parts.
CONSTITUTION: A wafer packing container 10 is comprised of the body 12 and a lid part 14. A wafer carrier 13 can be contained inside the body case 12. A U-shaped seal groove is provided to a vertical part of the main body case 12 for fittingly inserting a gasket 15. Clip recessed parts for putting four clips 30 are formed in the lid part 14 for fitting a vertical part of the body case 12 and a vertical part 45 of the lid part 14 integrally. A fitting recessed part for inserting an upper edge projecting part of the clip 30 is also provided for fitting the clip 30 to the lid part 14 to be fitted and removed freely. Thereby, fitting property between the case 12 of a box body and the lid body 14 is improved, airtightness is improved and contamination from the air can be prevented.
TERADA MITSUO
NISHIZAWA KIYOSHI
UCHIDA ATSUSHI
KOMATSU DENSHI KINZOKU KK
KOMATSU KASEI KK