Title:
WAFER TRANSFER METHOD AND WAFER TREATMENT MODULE
Document Type and Number:
Japanese Patent JPH0645425
Kind Code:
A
Abstract:
PURPOSE: To decrease contamination with respect to processed wafers, and to make devices compact. CONSTITUTION: A wafer processed by a process station 104 is contained in a wafer support 10 By extending and retracting a transfer arm 28. A door for the wafer support 10 is closed, pressure in a load-lock 12 is increased. A wafer processing module, including a plurality of process stations, is also disclosed.
Inventors:
SESHIRU JIEI DEEBISU
TEIMOSHII EI UURUDORITSUJI
DOYUAN II KAATAA
JIYON II SUPENSAA
ROBAATO MACHIYUUZU
RANDOORU SHII HIRUDENBURANDO
TEIMOSHII EI UURUDORITSUJI
DOYUAN II KAATAA
JIYON II SUPENSAA
ROBAATO MACHIYUUZU
RANDOORU SHII HIRUDENBURANDO
Application Number:
JP4673493A
Publication Date:
February 18, 1994
Filing Date:
March 08, 1993
Export Citation:
Assignee:
TEXAS INSTRUMENTS INC
International Classes:
H01L21/677; B25J15/08; B65G1/00; B65G1/02; B65G1/04; B65G1/07; B65G49/00; B65G49/07; C23C14/56; C23C16/44; C23F4/00; H01L21/00; H01L21/67; H01L21/68; H01L21/687; (IPC1-7): H01L21/68; B25J15/08; B65G1/02; B65G49/00; B65G49/07
Domestic Patent References:
| JPS57149748A | 1982-09-16 | |||
| JPS5337546U | 1978-04-01 | |||
| JPS58292U | 1983-01-05 | |||
| JPS57113245A | 1982-07-14 | |||
| JPS6020515A | 1985-02-01 | |||
| JPS5337456U | 1978-04-01 |
Attorney, Agent or Firm:
Akira Asamura (2 outside)
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