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Title:
THERMOPLASTIC RESIN COMPOSITION AND COMPATIBILIZER
Document Type and Number:
Japanese Patent JPH0657047
Kind Code:
A
Abstract:

PURPOSE: To provide the resin composition excellent in impact resistance, delamination resistance and fluidity and useful for moldings, etc., by blending a vinyl chloride based resin, etc., with an olefin-based resin and a specific compatibilizer in a specific ratio.

CONSTITUTION: The resin composition is obtained by blending 100 pts. wt. total amount of (A) 1-99 pts.wt. vinyl chloride-based resin and/or styrene-based resin and (B) 99-1 pts.wt. olefin-based resin such as PP with (C) 0.1-50 pts. wt. compatibilizer consisting of (i) 5-95 pts.wt. modified olefin-based polymer containing 0.05-50wt.% compound having a reactive group such as carboxyl group and (ii) 95-5 pts.wt. modified vinyl chloride-based polymer containing 0.05-50wt.% compound having a reactive group capable of reacting with the component (i), e.g. epoxy group, amino group or hydroxyl group.


Inventors:
WADA KAZUHITO
MISHIMA YASUHIRO
Application Number:
JP23280292A
Publication Date:
March 01, 1994
Filing Date:
August 06, 1992
Export Citation:
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Assignee:
KANEGAFUCHI CHEMICAL IND
International Classes:
C08L23/00; C08L23/26; C08L25/00; C08L25/04; C08L27/00; C08L27/06; C08L51/04; C08L101/00; (IPC1-7): C08L23/00; C08L23/00; C08L25/04; C08L27/06; C08L51/04; C08L101/00
Attorney, Agent or Firm:
Kenji Itami



 
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