【発明の名称】半導体装置およびその製造方法

Title:

【発明の名称】半導体装置およびその製造方法

Document Type and Number:

Japanese Patent JP2553694

Kind Code:

B2

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Inventors:

NISHIO MIKIO
NAKAO ICHIRO

Application Number:

JP5833589A

Publication Date:

November 13, 1996

Filing Date:

March 10, 1989

Export Citation:

Assignee:

MATSUSHITA ELECTRIC IND CO LTD

International Classes:

H01L21/76; H01L21/31; H01L29/78; (IPC1-7): H01L29/78

Domestic Patent References:

Attorney, Agent or Firm:

Tomoyuki Takimoto

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