Title:
【発明の名称】半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP2868007
Kind Code:
B1
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device which is capable of preventing the developing corrosion and peel-off of a metallic heat sink, improving its radiation characteristics, and being manufactured with low costs. SOLUTION: First, a copper plate 1 is clad on each side of a molybdenum plate 2 to form a clad plate, the clad plate is press cut and then plated on its surface with electroless nickel, to form an electroless nickel plated layer 4 as a heat sink. Next, when a ceramic frame is placed on the radiator plate via a silver/copper brazing material provided therebetween and then heated, the brazing material melts and the heat sink and ceramic frame are braze jointed together. Also the molten brazing material flows out and reaches an end face of the heat sink and a semiconductor-element mounting surface, which results in the formation of a silver/copper alloy film 7 of the brazing material on the front surface and end face of the heat sink. Thereafter, the entire plate is plated with gold to form a gold plated layer over the entire surface of the plate.
Inventors:
Yukio Nomura
Application Number:
JP31408897A
Publication Date:
March 10, 1999
Filing Date:
November 14, 1997
Export Citation:
Assignee:
NEC
International Classes:
C04B37/02; B32B15/01; C23C18/32; C23C30/00; H01L23/02; H01L23/34; H01L23/373; (IPC1-7): H01L23/34
Attorney, Agent or Firm:
Masanori Fujimaki