Title:
【発明の名称】半導体材料加工方法及び装置
Document Type and Number:
Japanese Patent JP2875513
Kind Code:
B2
Abstract:
The method employs a microcontroller (8) programmed to operate each of an array of nozzles (2) through which a cleaning fluid (5) is directed from a reservoir (4) at the working surface (1) of the grinding tool. Each nozzle contains a transducer (6) made e.g. from tantalum or piezoceramic material and generating ultrasound at a different frequency. The transducers are excited by oscillators (7) of various intensities with links to the microcontroller, which also varies the output of cleaning fluid through the valve supplying each nozzle from the reservoir.
Inventors:
HORUGAA RUNDO
KAARU KOOBURAA
HANIFUI MARUKOTSUKU
KAARU KOOBURAA
HANIFUI MARUKOTSUKU
Application Number:
JP27820996A
Publication Date:
March 31, 1999
Filing Date:
October 21, 1996
Export Citation:
Assignee:
WATSUKAA JIRUTORONIKU G FUYUA HARUBURAITAAMATERIARIEN AG
International Classes:
B24B57/02; B23D59/00; B23D59/02; B24B1/04; B24B53/007; B24B53/017; B24D5/12; B28D5/02; B28D7/02; H01L21/00; H01L21/304; H01L21/306; (IPC1-7): B28D7/02; B24B57/02; B28D5/02; H01L21/304
Domestic Patent References:
| JP6311273A | ||||
| JP7285073A | ||||
| JP48134A | ||||
| JP6270051A | ||||
| JP571388B2 |
Attorney, Agent or Firm:
Tadashi Hagino (3 outside)