Title:
【発明の名称】半導体パッケージ及びその製造方法
Document Type and Number:
Japanese Patent JP2992460
Kind Code:
B2
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Inventors:
KUZUHARA KAZUNARI
Application Number:
JP21911195A
Publication Date:
December 20, 1999
Filing Date:
August 28, 1995
Export Citation:
Assignee:
MATSUSHITA DENKO KK
International Classes:
H01L21/60; H01L21/301; H01L21/321; H01L21/56; H01L23/12; (IPC1-7): H01L21/56; H01L21/301; H01L21/60
Domestic Patent References:
| JP7161764A |
Attorney, Agent or Firm:
Keisei Nishikawa (1 person outside)