Title:
【発明の名称】半導体パッケージ及び樹脂封止方法
Document Type and Number:
Japanese Patent JP3002462
Kind Code:
B1
Inventors:
Fumio Miyajima
Toshiaki Kitagawara
Toshiaki Kitagawara
Application Number:
JP34604698A
Publication Date:
January 24, 2000
Filing Date:
December 04, 1998
Export Citation:
Assignee:
Apic Yamada Co., Ltd.
International Classes:
H01L21/60; B29C45/14; B29C45/26; H01L21/56; H01L23/12; H01L23/28; (IPC1-7): H01L21/56; B29C45/14; B29C45/26; H01L23/12; H01L23/28
Domestic Patent References:
| JP10256432A | ||||
| JP6181148U | ||||
| JP61199001U |
Attorney, Agent or Firm:
Takao Watanuki (1 outside)