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Title:
【発明の名称】半導体の封止方法
Document Type and Number:
Japanese Patent JP2985549
Kind Code:
B2
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Inventors:
SHINOHARA HIRONOBU
Application Number:
JP35490492A
Publication Date:
December 06, 1999
Filing Date:
December 18, 1992
Export Citation:
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Assignee:
JEI ESU AARU KK
International Classes:
B29C45/00; C08L65/00; H01L21/56; H01L23/29; H01L23/31; (IPC1-7): H01L23/29; C08L65/00; H01L21/56; H01L23/31
Attorney, Agent or Firm:
Shirai Shigetaka



 
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