【発明の名称】スライシングマシンおよびその制御方法

Japanese Patent JPH0671727

B2

PURPOSE:To enhance the surface accuracy of the processed surface of material to be processed by means of a simple structure by sensing the displacement of a cutting tool at the time of cutting and modifying the number of revolutions of a rotator by means of modifying the number of revolutions computed by a modifying computation means. CONSTITUTION:A slicing machine forms wafers by, for instance, slicing a silicon ingot SI. A tension disc 42 on which a tool consisting of a device blade 44 and a cutting edge 46 is supported to be able to revolve and drive. The blade 44 is displaced along in the direction of a main shaft 26 in accordance with the number of revolutions. A calibration device 58 is provided with a first sensor 54a to sense the number of revolutions of the main shaft 26 and a second sensor 54b to sense the displacement of the blade 44. An arithmetic unit 64 computates the modified number of revolutions of a tension disc 42 making the displacement sensed by a sensing means as zero. A control device 66 modifies the number of revolutions of the tension disc 42 by means of the modified number of revolutions computed by the arithmetic unit 64. The displacement of a cutting tool, therefore, is not generated actually.

Kawaguchi Keiji
Hamasaki Tatsumi
Yoshihiro Tadera
Yukio Yamazaki

JP705688A

September 14, 1994

January 18, 1988

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Mazda Corporation Inc

B28D5/02; B23D59/00; B23Q15/12; B28D5/00; (IPC1-7): B28D5/02

JP58181517A
JP5151082A
JP58179609A
JP5930667A
JP6270904U

Yasunori Otsuka (1 person outside)

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