Title:
【発明の名称】構造化プリント回路基板および箔プリント回路基板、およびそれらの製造方法
Document Type and Number:
Japanese Patent JPH08501663
Kind Code:
A
Abstract:
PCT No. PCT/CH94/00134 Sec. 371 Date Mar. 6, 1995 Sec. 102(e) Date Mar. 6, 1995 PCT Filed Jun. 24, 1994 PCT Pub. No. WO95/02312 PCT Pub. Date Jan. 19, 1995Multilayer printed circuit boards, foil printed circuit boards and metal-clad laminates for foil circuit boards and a process for the manufacture thereof, with interfacial connections structured in insulator layers, with resist openings of surface structured in resist coatings, with current paths structured in conductor layers and with contact points and in which for reducing the number of photochemical structurings or patternings required the interfacial connections and resist openings are mechanically structured, in that interfacial connection openings preworked in insulator layers are etched according to interfacial connection structures of mask foils, that in the interfacial connection openings are deposited electrically conductive deposition substances for the formation of contact layers in said openings. In the coating layers are etched resist openings according to contacting structures of mask foils, so that the resist openings form resist material-free areas on the circuit boards, foil circuit boards and metalclad laminates for foil circuit boards and the resist openings are worked in freely shaped manner and have circular cylindrical, circular, oval, square, rectangular or polygonal diameters.
Inventors:
Martelli, Marco
Schmidt, Walter
Schmidt, Walter
Application Number:
JP50373095A
Publication Date:
February 20, 1996
Filing Date:
June 24, 1994
Export Citation:
Assignee:
Daiconex Patente Actien Gezel Shaft
International Classes:
H05K3/00; H05K3/42; H05K3/46; H05K3/28; H05K1/00; (IPC1-7): H05K3/00; H05K3/28; H05K3/42; H05K3/46
Attorney, Agent or Firm:
Akira Asamura (3 outside)