Title:
【発明の名称】難燃性樹脂組成物よりなる表面実装対応電子部品
Document Type and Number:
Japanese Patent JP2669921
Kind Code:
B2
Abstract:
PURPOSE:To obtain a resin composition having excellent water-absorption characteristics, dimensional characteristics and reflow soldering resistance and suitable as a material for electronic part for surface-mounting by compounding a flame-retarded glass-fiber reinforced nylon 46 resin with a specific amount of a specific aliphatic polyamide resin. CONSTITUTION:The objective composition is produced by compounding (A) 100 pts.wt. of nylon 46 resin with (B) 5-100 pts.wt. of an aliphatic polyamide resin having methylene groups and amide groups in the polymer main chain at a number ratio (methylene/amide) of >=6 (e.g. nylon 12, nylon 11, nylon 612 or nylon 66/636 copolymer), (C) 2-100 pts.wt. of a brominated polystyrene, (D) 1-50 pts.wt. of a flame-retarding assistant (preferably antimony trioxide) and (E) 5-200 pts.wt. of glass fiber.
Inventors:
Katsuhiko Hironaka
Nishijima Kiyoaki
Nishijima Kiyoaki
Application Number:
JP10684290A
Publication Date:
October 29, 1997
Filing Date:
April 23, 1990
Export Citation:
Assignee:
Teijin Limited
International Classes:
C08K3/22; C08K7/14; C08L25/18; C08L73/00; C08L77/00; C08L77/06; (IPC1-7): C08L77/06; C08K3/22; C08K7/14; C08L25/18; C08L77/00
Domestic Patent References:
| JP61188455A | ||||
| JP62156160A | ||||
| JP63139942A | ||||
| JP41266A |
Attorney, Agent or Firm:
Maeda Junhiro