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Patent Searching and Data


Title:
FORMATION OF VIA IN CERAMIC LAMINATE
Document Type and Number:
Japanese Patent JPH0745470
Kind Code:
A
Abstract:

PURPOSE: To enhance the reliability and production yield by facilitating the alignment between vias and ensuring the electrical connection between upper and lower vias or between the via part and the inner electrode pattern.

CONSTITUTION: When ceramic green sheets 10 are laminated, vias are made at corresponding positions in adjacent green sheets and metal powder 18 is filled therein. The green sheets are then laminated and sintered thus electrically connecting the layers through the metallic material filled in the via. A combination of large via 12 and small via 14 is made at the corresponding positions in adjacent green sheets. The diameter of large via 12 is preferable set 1.2-2 times as large as that of small via 14.


Inventors:
SAKATA HIDEO
GOTOU KOUSUKE
Application Number:
JP20708193A
Publication Date:
February 14, 1995
Filing Date:
July 29, 1993
Export Citation:
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Assignee:
FUJI ELECTROCHEMICAL CO LTD
International Classes:
H01G4/232; H01G4/12; H01G4/30; H05K1/09; H05K3/40; H05K3/46; (IPC1-7): H01G4/12; H01G4/232; H01G4/30
Attorney, Agent or Firm:
Shigemi