Title:
【発明の名称】高導電性の重合体厚膜組成物
Document Type and Number:
Japanese Patent JP2974256
Kind Code:
B2
Abstract:
A thermally curable conductive polymer thick film composition comprising, by weight: (a) about 3-15 parts of at least one thermoplastic vinyl acetate/vinyl chloride/dicarboxylic acid multipolymer resin; (b) a second thermoplastic resin selected from the group consisting of: (i) about 1-6 parts of at least one thermoplastic polyurethane resin; (ii) about 2-10 parts of at least one thermoplastic polyester resin; or (iii) about 1-10 parts of a mixture of at least one thermoplastic polyurethane and at least one thermoplastic polyester resin; (c) about 0.05-1 parts of a tertiary amine; (d) an effective amount of at least one organic solvent capable of substantially dissolving (a), (b), and (c) ingredients; and (e) about 50-80 parts of silver flake.
Inventors:
FURENTSUERU RICHAADO ERU
CHAN ANDORUU
CHAN ANDORUU
Application Number:
JP50761291A
Publication Date:
November 10, 1999
Filing Date:
March 28, 1991
Export Citation:
Assignee:
ACHESON IND INC
International Classes:
C08J3/21; C08K3/08; C08L27/06; C08L31/04; C08L33/04; C08L35/00; C08L67/00; C08L67/02; C08L75/00; C08L75/04; C09D5/24; C09D127/04; C09D127/06; C09D131/04; C09D133/04; C09D135/00; H01B1/22; H01H13/785; H05K1/03; H05K1/09; H01H13/702; (IPC1-7): C09D5/24; C08J3/21; C08K3/08; C08L27/06; C08L31/04; C08L35/00; C08L67/02; C08L75/04; C09D127/06; C09D131/04; C09D135/00; H01B1/22; H05K1/09
Attorney, Agent or Firm:
Chika Takagi (2 outside)