Title:
【発明の名称】弾性を有するポリアミド
Document Type and Number:
Japanese Patent JP2916192
Kind Code:
B2
Abstract:
Polyamides suitable for use as hot melt adhesives, eg with polyepoxide resins can be prepared from 1. one or more polyoxyalkylene polyamines having an average molecular weight of 148 to 500, 2. a dimer acid having at least 36 carbon atoms, and 3. a short chain dicarboxylic acid. The materials can be reacted at 170 to 280C in a mole ratio, total amine to acid, of 0.8:1.0 to 1.25:1.0. The softening point and shear strength of the adhesive can be adjusted by adjusting the ratio of the reacting materials.
Inventors:
JOOJI FUIRITSUPU SUPERANZA
UEIIYAN SUU
UEIIYAN SUU
Application Number:
JP4469690A
Publication Date:
July 05, 1999
Filing Date:
February 27, 1990
Export Citation:
Assignee:
HANTSUMAN PETOROKEMIKARU CORP
International Classes:
C08G69/28; C08G69/34; C08G69/40; C08G69/26; C08G69/46; C08L77/08; C09J163/00; C09J177/00; C09J177/06; C09J177/08; (IPC1-7): C08G69/40; C08G69/34; C09J177/08
Domestic Patent References:
| JP5377231A |
Other References:
【文献】米国特許4082708(US,A)
【文献】欧州公開301716(EP,A2)
【文献】欧州公開301716(EP,A2)
Attorney, Agent or Firm:
Heiyoshi Odashima