Title:
【発明の名称】サブアッセンブリを加熱する半導体処理炉
Document Type and Number:
Japanese Patent JP2001514799
Kind Code:
A
Abstract:
A vertically oriented thermal processor for processing batches of semiconductor wafers held within a processing chamber. The processing chamber is contained within a processing vessel. A furnace liner surrounds the processing vessel in spaced relationship. A flow path for cooling fluid is supplied between the furnace liner and an inner wall of the furnace heater. The flow occurs through end and base segments forming part of the furnace heating enclosure. The end and base segments have interior ports which communicate with a manifold chamber. The manifold chamber is advantageously divided into inner and outer chambers by shields which reflect radiant heat. The inner and outer manifold chambers are connected by manifold connecting passages formed between the shields.
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Inventors:
Weaver, Robert A.
Peck, Kevin Bee
McEntire, William Di
Peck, Kevin Bee
McEntire, William Di
Application Number:
JP53880998A
Publication Date:
September 11, 2001
Filing Date:
March 05, 1998
Export Citation:
Assignee:
Semitour Incorporated
MRL Industries, Inc.
MRL Industries, Inc.
International Classes:
C30B31/12; H01L21/00; H01L21/205; H01L21/22; F27D11/02; (IPC1-7): H01L21/22; F27D11/02; H01L21/205
Attorney, Agent or Firm:
Aoyama Ryo (1 person outside)