Title:
【発明の名称】マイクロ構造層の熱転写
Document Type and Number:
Japanese Patent JP2003515461
Kind Code:
A
Abstract:
Articles having a component with a surface defining microstructured features can be formed using thermal transfer elements. One example of a suitable thermal transfer element includes a microstructured layer having a surface defining microstructured features imposed on the micro structured layer. The thermal transfer element is configured and arranged for the transfer of at least a portion of the microstructured layer to a receptor while substantially preserving the microstructured features of that portion.
Inventors:
Dave, Mark K.
Wolk, Martin Bee.
Wolk, Martin Bee.
Application Number:
JP2001541700A
Publication Date:
May 07, 2003
Filing Date:
March 24, 2000
Export Citation:
Assignee:
3M Innovative Properties Company
International Classes:
B81C99/00; B41M3/00; B41M5/382; B81C1/00; H01J7/24; H01J9/02; H01L21/48; H01L21/68; B41M5/385; B41M5/40; B41M5/42; H05K3/04; (IPC1-7): B81C5/00; H01J9/02
Domestic Patent References:
| JPH04327983A | 1992-11-17 | |||
| JPH11224597A | 1999-08-17 | |||
| JPH1154028A | 1999-02-26 | |||
| JPS55121092A | 1980-09-17 | |||
| JPS5988780A | 1984-05-22 |
Attorney, Agent or Firm:
Takashi Ishida (4 others)