Title:
【発明の名称】X線露光装置用ウエハ冷却装置
Document Type and Number:
Japanese Patent JP2928603
Kind Code:
B2
Abstract:
A wafer cooling device, includes a wafer chuck; a heat exchanger having an internal structure for circulation of cooling water therethrough; and a flexible heat pipe for providing heat communication between the wafer chuck and the heat exchanger.
Inventors:
HARA SHINICHI
EBINUMA RYUICHI
EBINUMA RYUICHI
Application Number:
JP19910390A
Publication Date:
August 03, 1999
Filing Date:
July 30, 1990
Export Citation:
Assignee:
KYANON KK
International Classes:
G03F7/20; H01L21/00; H01L21/027; H01L21/30; H01L21/683; H01L23/34; H01L23/427; (IPC1-7): H01L21/027; G03F7/20
Domestic Patent References:
| JP2156622A | ||||
| JP1205419A | ||||
| JP1140818U |
Attorney, Agent or Firm:
Wakabayashi Tadashi