Title:
【発明の名称】発泡プロセス及びアクリル繊維を使用するプリント回路基板製造のための基材ウェブ
Document Type and Number:
Japanese Patent JP2003510823
Kind Code:
A
Abstract:
A printed circuit board is made from at least one non-woven sheet or web layer comprising at least 50% by weight acrylic fibers, with any balance substantially electrically non-conductive fibers, filler, and binder. The sheet or web is preferably made by the foam process, and may contain 60-80% straight polyacrylonitrile fibers and 40-20% fibrillated (pulp) ones. The web or sheet is preferably compressed by thermal calendering so that it has a density of about 0.1-1 grams per cubic centimeter; and the web or sheet may have a basis weight of between about 20-120 grams per square meter. The web or sheet may also have a 1-40% of substantially electrically non-conductive organic or inorganic binder, or may be substantially binder free. A printed circuit board made using the layers of these non-woven webs or sheets is otherwise conventional, including a pre-preg material, electrically conductive circuit elements, and electronics, and has improved properties compared to woven glass and non-woven aramid products, including improved fiber consolidation, easy board construction, and improved MD/CD ratio and stability.
Inventors:
Commlenic, rod
Renels, Kelly
Lekman, Kai
Sabel, hokan
Renels, Kelly
Lekman, Kai
Sabel, hokan
Application Number:
JP2001526014A
Publication Date:
March 18, 2003
Filing Date:
September 20, 2000
Export Citation:
Assignee:
Ahlstrom Grassfibble Salmon Yukiture
International Classes:
B32B5/28; C08J5/04; D04H1/42; C08J5/24; D21F11/00; D21H13/18; H05K1/03; D21H13/22; D21H13/24; D21H13/26; D21H13/40; D21H25/00; D21H25/04; D21H25/06; (IPC1-7): H05K1/03; D04H1/42
Attorney, Agent or Firm:
Akira Asamura (3 outside)