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Patent Searching and Data


Title:
【発明の名称】ワイヤボンディング、切断、及びボール形成
Document Type and Number:
Japanese Patent JPH11508407
Kind Code:
A
Abstract:
A method of stimulating production of photo-electrons at a cathode element (118) of an EFO system (116) of a wire bonder (100) is disclosed. Said method comprises illuminating the cathode element (118) of the EFO component with ultraviolet light having sufficient energy to stimulate the production of photo-electrons at the cathode element (118).

Inventors:
Eldridge Benjamin N
Matthew, Gaetan, El
Application Number:
JP53519596A
Publication Date:
July 21, 1999
Filing Date:
May 24, 1996
Export Citation:
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Assignee:
Form Factor, Incorporated
International Classes:
B23K9/067; B23K20/00; C23C18/16; C25D7/12; G01R1/073; G01R31/28; H01L21/00; H01L21/48; H01L21/56; H01L21/60; H01L21/603; H01L21/66; H01L23/48; H01L23/485; H01L23/49; H01L23/498; H01L25/065; H01L25/16; H05K3/32; H05K3/40; C25D5/08; C25D5/22; C25D21/02; G01R1/067; G01R3/00; H05K1/14; H05K3/20; H05K3/34; H05K3/36; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Kaoru Furuya (2 outside)