PURPOSE: To obtain a burn-in socket, which can perform the accurate burn-in test for various kinds of semiconductor chips without damaging the surfaces of the semiconductor chips and can be used many times.

CONSTITUTION: A sheet 33, wherein a bump 31 of a semiconductor chip 32 is mounted on the surface, and which is formed of anisotropic conducting material so as to have an electrical continuity only in the up and down directions, a supporting part 34, which is fixed by a fixing means so that the semiconductor chip is supported and aligned, and an inner pad 34, which is electrically connected to the semiconductor chip 32 through the sheet, are provided. Furthermore, a board 38 having a contact pad 37, which connects the inner pad and input/output terminals, a lower socket 39 having input/output terminals for connection to the outside and an upper socket 44, which is mounted on the lower socket so as to shield the semiconductor chip from the outside, are provided.