Title:
WIRE BONDER
Document Type and Number:
Japanese Patent JPH0831856
Kind Code:
A
Abstract:
PURPOSE: To obtain a wire bonder in which the quality is stabilized while enhancing mass productivity.
CONSTITUTION: When a wire 3 is bonded to a semiconductor chip 1, a holding circuit 13 stores the displacement of an oscillator 5 until a ball 3b comes into contact with the semiconductor chip 1. A subtractor 14 then subtracts the output of a converter 11 from the output of the holding circuit 13 thus determining the collapse of the ball. When the collapse of the ball reaches a preset value Vs, a controller 16 interrupts the operation of an ultrasonic oscillator 7 and the oscillator 5 is pulled up again by means of a motor 6.
Inventors:
KURATO KENJI
KAMEDA HIROSHI
GOTO HIROFUMI
KAMEDA HIROSHI
GOTO HIROFUMI
Application Number:
JP15856094A
Publication Date:
February 02, 1996
Filing Date:
July 11, 1994
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
B23K20/00; B23K20/10; H01L21/60; (IPC1-7): H01L21/60; B23K20/00; B23K20/10
Attorney, Agent or Firm:
Shizuo Sano