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Patent Searching and Data


Title:
BALL TYPE WIRE BONDING METHOD
Document Type and Number:
Japanese Patent JPH0645390
Kind Code:
A
Abstract:

PURPOSE: To prevent clogging of a capillary tool with a metal wire in the case of forming a ball part by applying an ultrasonic vibration to the tool simultaneously when a spark discharge is generated between the wire and a spark torch.

CONSTITUTION: When a spark discharge is generated between a metal wire 5 and a spark torch 7, an ultrasonic vibration is simultaneously applied to a capillary tool 4. That is, the tool 4 is moved down toward a semiconductor chip 1 thereby to press.connect a ball part 5a at an end of the wire 5 to the chip 1. In this case, the vibration is applied to the tool 4 by ultrasonic wave oscillating means mounted at a tool horn 6 to increase a connecting strength of the part 5a to the chip 1. Thus, adherence of cinder of a film generated from the wire 5 due to the spark discharge to the tool 4 is prevented, and clogging of the tool is prevented.


Inventors:
OKUMURA HIROMORI
Application Number:
JP19565592A
Publication Date:
February 18, 1994
Filing Date:
July 22, 1992
Export Citation:
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Assignee:
ROHM CO LTD
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Akio Ishii (2 outside)