Title:
【発明の名称】半導体加工に利用される水性浴の寿命限界を検出するための装置および方法
Document Type and Number:
Japanese Patent JP2003509860
Kind Code:
A
Abstract:
Arrangement and method for detecting the end of life of an aqueous bath utilized in semiconductor processing, the bath containing water, an amount of hydrogen peroxide and an amount of a predetermined chemical species, which is either an acid or a base, in accordance with the following steps: adding a predetermined additional amount of the hydrogen peroxide and/or the predetermined chemical species at predetermined time intervals, measuring at least one parameter of the aqueous bath, thereby obtaining a measured parameter value, the at least one parameter being selected from a set of parameters including bath pH and bath conductivity; reading a predicted value of said at least one parameter from a memory storing a curve of predicted values of said at least one parameter as a function of time, said curve depending on said predetermined additional amount of said hydrogen peroxide and/or said predetermined chemical species, and depending on said predetermined time intervals; establishing the end of life of said aqueous bath on the basis of a predetermined deviation between said measured parameter value and said predicted value.
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Inventors:
Dirk, M. Notter
Leonardus, C. Winters
Selvatius, M. Bliss Hovers
Leonardus, C. Winters
Selvatius, M. Bliss Hovers
Application Number:
JP2001524136A
Publication Date:
March 11, 2003
Filing Date:
August 31, 2000
Export Citation:
Assignee:
Konin Krekka Philips Electronics NV
International Classes:
H01L21/304; G05D21/02; H01L21/306; (IPC1-7): H01L21/304
Attorney, Agent or Firm:
Kenji Yoshitake (3 others)