Title:
【発明の名称】半導体ウェーハ用研磨パッドのドレッシング装置
Document Type and Number:
Japanese Patent JP2997804
Kind Code:
B2
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Inventors:
Toshiro Doi
Masahiko Amari
Takaho Saito
Keiji Miyaji
Yoshiyuki Seike
Masahiko Amari
Takaho Saito
Keiji Miyaji
Yoshiyuki Seike
Application Number:
JP4784797A
Publication Date:
January 11, 2000
Filing Date:
March 03, 1997
Export Citation:
Assignee:
Asahi Sunac Co., Ltd.
Toshiro Doi
Toshiro Doi
International Classes:
B24B37/00; B24B53/007; B24B53/017; H01L21/304; (IPC1-7): B24B37/00; H01L21/304
Domestic Patent References:
| JP79340A | ||||
| JP2237655A |
Attorney, Agent or Firm:
Kenzo Matsuura