【発明の名称】チップ間ボンディングを有する集積回路パッケージおよびその方法

Title:

【発明の名称】チップ間ボンディングを有する集積回路パッケージおよびその方法

Document Type and Number:

Japanese Patent JP2001523400

Kind Code:

A

Abstract:

An integrated circuit package that has the ability for interdevice communication. The integrated circuit package has a first device mounted within the integrated circuit package. A second device is also mounted within the integrated circuit package. The second device is directly coupled to the first device through interdevice bonding for allowing the first device and the second device to communicate and control one another.

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Inventors:

Drehoble, Steve Buoy.
Fernandez, Joseph Dee.
Charles, Mike

Application Number:

JP54509899A

Publication Date:

November 20, 2001

Filing Date:

March 04, 1999

Export Citation:

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Assignee:

MICROCHIP TECHNOLOGY INCORPORATED

International Classes:

H01L21/60; H01L23/495; H01L23/50; H01L23/52; H01L25/04; H01L25/065; H01L25/18; (IPC1-7): H01L25/04; H01L21/60; H01L23/50; H01L23/52; H01L25/18

Attorney, Agent or Firm:

Shusaku Yamamoto

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