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Patent Searching and Data


Title:
【発明の名称】熱的絶縁性及び導電性を有する相互接続構造及びその生成方法
Document Type and Number:
Japanese Patent JP2565524
Kind Code:
B2
Abstract:
A pyroelectric focal plane array useful for thermal imaging applications comprises a detector (10), comprises a reticulated and aluminized pyroelectric chip (12) interfaced with a signal processor chip (14) by thermally insulating bumps (30) coated with a thin conductive layer (38) to form a plurality of thermally insulative and electronically conductive interconnections (16) between detector chips (12) and processor chip (14).

Inventors:
SHAHAMU IFUARU JEI
PINESU MIKAERU WAI
KODA ENU JON
MAFUI DANIERU EFU
Application Number:
JP50333887A
Publication Date:
December 18, 1996
Filing Date:
May 12, 1987
Export Citation:
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Assignee:
HUGHES AIRCRAFT CO
International Classes:
H01L23/52; G01J5/34; H01L21/3205; H01L21/60; H01L25/16; H01L27/16; H01L37/00; H01L37/02; (IPC1-7): H01L21/3205; H01L21/321
Other References:
【文献】米国特許4740700(US,A)
Attorney, Agent or Firm:
Takehiko Suzue (2 outside)