Title:
【発明の名称】積層体とそれを使用した厚膜回路の製造方法
Document Type and Number:
Japanese Patent JP3322128
Kind Code:
B2
Inventors:
Yasumasa Akimoto
Junichi Arai
Junichi Arai
Application Number:
JP17678696A
Publication Date:
September 09, 2002
Filing Date:
July 05, 1996
Export Citation:
Assignee:
Toppan Printing Co., Ltd.
International Classes:
H05K1/16; B32B7/06; B32B7/10; B32B15/08; B32B27/18; H05K3/02; H05K3/20; H05K3/46; (IPC1-7): B32B7/06; B32B7/10; B32B15/08; B32B27/18; H05K1/16; H05K3/02; H05K3/20
Domestic Patent References:
| JP8116150A |
Attorney, Agent or Firm:
Teruo Akimoto