Title:
【発明の名称】内周刃スライサーによる単結晶インゴットの切断方法及び装置
Document Type and Number:
Japanese Patent JPH0612768
Kind Code:
B2
Abstract:
An improved method of using an ID saw slicing machine (1) for slicing a single crystal ingot (6) in a direction normal to the axis of the ingot (6) to obtain wafers. The feed of the single crystal ingot (6) to the blade (2) of the ID saw slicing machine (1) is increased and decreased alternately in accordance with a predetermined control pattern.
Inventors:
TOYAMA KOHEI
Application Number:
JP12660990A
Publication Date:
February 16, 1994
Filing Date:
May 18, 1990
Export Citation:
Assignee:
SHINETSU HANDOTAI KK
International Classes:
B23D59/00; B23Q15/013; B28D5/00; B28D5/02; H01L21/304; (IPC1-7): H01L21/304; B28D1/22
Attorney, Agent or Firm:
Ryoichi Yamashita