Title:
【発明の名称】布線されたプリント配線板を製造するための方法と装置
Document Type and Number:
Japanese Patent JP2002501677
Kind Code:
A
Abstract:
The invention relates to a printed circuit board (1) which is wire-written inside. The inventive printed circuit board is characterised in terms of how it is produced in that after a mould has been partially filled with a curable insulating compound, electrically conductive contact elements (2, 3) are positioned and said insulating compound is then cured. The corresponding contact elements are then wired inside the board on this layer. The casting mould is subsequently further filled with curable insulating compound as far as the top of the printed circuit board, in line with the first layer (4), and the upper and lower faces are surface-ground. Other wiring levels (5, 6) filled with insulating compound can be added. Prefabricated boards which are already filled with insulating material (7) and have recesses for the contact elements can also be provided. Adhesive coatings can be used so that the wires (8) are easier to fix on the layer (s). This method can also be used to produce three-dimensional, non-planar printed circuit boards.
Inventors:
Marx Wervel
Jurgen Gottlieb
Jurgen Gottlieb
Application Number:
JP50123299A
Publication Date:
January 15, 2002
Filing Date:
June 02, 1997
Export Citation:
Assignee:
Yuma Reiter Platten-Tehnologie Gezel Shaft Mitt Beschlenktel Haftung
International Classes:
H05K3/10; H05K3/20; H05K3/40; H05K7/06; (IPC1-7): H05K3/20; H05K3/10; H05K7/06
Attorney, Agent or Firm:
Toshio Yano (2 outside)