【発明の名称】非磁性化工作物からウェーハーを切断する際の切断状況を監視するための方法と装置 - Wacker, Chemitronic, Gesellschaft, Fur, Electronic, Grundstoffe, Mitt, Beschlenktel, Haftung

Title:

【発明の名称】非磁性化工作物からウェーハーを切断する際の切断状況を監視するための方法と装置

Document Type and Number:

Japanese Patent JPH0714608

Kind Code:

B2

Abstract:

During the cutting-off of wafers from work pieces, such as, for example, semiconductor rods, the control of saw blade excursions in the interior of the work piece is important. According to the invention, a magnetic continuous field passing through the wafer to be cut off is built up for this purpose between a fixed measuring unit and the cutting-off tool, which continuous field changes in the event of deviations of the cutting-off tool from the desired line of cut. By measuring, for example, the resulting force of attraction, the change can be detected and the cutting-off tool can be brought back into the desired direction by control adjustment. In this way, wafers having excellent flatness are obtained.

Inventors:

Joachim Junge
Johann Glass
Johann Niedermeier
Gerhard Brehm

Application Number:

JP19440089A

Publication Date:

February 22, 1995

Filing Date:

July 28, 1989

Export Citation:

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Assignee:

Wacker, Chemitronic, Gesellschaft, Fur, Electronic, Grundstoffe, Mitt, Beschlenktel, Haftung

International Classes:

B23Q17/09; B23D59/00; B28D5/02; H01L21/301; H01L21/304; (IPC1-7): B28D5/02; B23Q17/09; H01L21/304

Domestic Patent References:

JP6179550A
JP6270904U

Attorney, Agent or Firm:

Kiyotaka Sasaki (3 outside)

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