Title:
【発明の名称】板状体を媒介とする熱エネルギ伝達方法及び装置
Document Type and Number:
Japanese Patent JP2681672
Kind Code:
B2
Abstract:
In processing plate-type objects, especially semiconductor chips, for example in vacuum technology, they are often heated to elevated temperatures. It is then desirable to apply the thermal energy in a controlled and homogeneous manner. In other cases it is necessary to cool the chips in a controlled and uniform manner.
Gas conduction technology is known to make possible a so-called thermal coupling between two adjacent surfaces and this can be combined with the advantages of thermal transfer by gas conduction. The invention makes full use of the advantages of this gas conduction heat transfer for the transfer of heat between a backplate and a chip and in doing so avoids the disadvantages of a mechanical loading by prestressing the chip. For this purpose, a gas is used both as a gas cushion to improve the heat transfer between chip and backplate and also to press the chip onto the backplate avoiding a mechanical loading.
Inventors:
Hans Hirsche
Rudolf Bergner
Rudolf Bergner
Application Number:
JP28901688A
Publication Date:
November 26, 1997
Filing Date:
November 17, 1988
Export Citation:
Assignee:
Balzers Akchengezel Shaft
International Classes:
F28D21/00; H01L21/00; F28D1/03; H01L21/67; (IPC1-7): F28D21/00; H01L21/68
Domestic Patent References:
| JP56103442A |
Attorney, Agent or Firm:
Tetsuro Ikuta