Title:
【発明の名称】ガラスと金属あるいは半導体材料との陽極ボンディングされた2次元合成物の湾曲を変化させる方法
Document Type and Number:
Japanese Patent JPH10507415
Kind Code:
A
Abstract:
PCT No. PCT/EP95/03825 Sec. 371 Date Oct. 6, 1997 Sec. 102(e) Date Oct. 6, 1997 PCT Filed Sep. 27, 1995 PCT Pub. No. WO96/11806 PCT Pub. Date Apr. 25, 1996A method for the controlled bending of anodically bonded two-dimensional composites of glass and metal or semiconductor materials. The composite is heated after bonding, for up to 200 hours to a temperature of from 250 DEG C. to Tg-10 K. As a result of this heating, controlled compaction of the glass body and, hence, bending of the composite, are achieved to reduce or reverse any distortion that has occurred during bonding.
Inventors:
Harz, Michael
Engelke, Heinrich
Engelke, Heinrich
Application Number:
JP51288196A
Publication Date:
July 21, 1998
Filing Date:
September 27, 1995
Export Citation:
Assignee:
Harz, Michael
Engelke, Heinrich
Engelke, Heinrich
International Classes:
B32B17/06; C03C27/00; C03C27/02; G01C19/00; G01P1/02; G01P15/03; G01P15/08; H01L21/02; H01L21/20; (IPC1-7): B32B17/06
Domestic Patent References:
| JPH02158174A | 1990-06-18 | |||
| JPH0350141A | 1991-03-04 | |||
| JPH02133792A | 1990-05-22 | |||
| JPH0397551A | 1991-04-23 | |||
| JPH04323033A | 1992-11-12 |
Attorney, Agent or Firm:
Kenzo Hara