PURPOSE: To provide excellent adhering conditions without complicated operations even when the characteristics of a film is different by adhering the film to a lead frame by controlling the dislocation of a punch and permitting only the prescribed thickness of the frame to be reduced.
CONSTITUTION: An insulating or conductive adhesive film arranged on a die 5 is punched out by a punch 3. Then the film is adhered at a prescribed position on a lead frame 1 on a heater 6 arranged at the bottom of the die 5. The method controls especially the dislocation of the punch 3 in the vertical direction, and the adhesive film 2 is pressed so as to reduce the prescribed thickness and is adhered to the lead frame 1. The prescribed thickness is approximately 3-5μm. When the thickness is less than 3μm, a partially non-adhered part is generated and when it is more than 5μm, too much pressing force is applied on the adhesive layer and the film peels. When constant pressure adhesion is simultaneously used, more stable adhering conditions are ensured.
KANEKO KENICHI
HIROE TOSHIKATSU
| JPH0488056U | 1992-07-30 |