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Patent Searching and Data


Title:
HOUSING FOR ELECTRIC, ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JPH0832249
Kind Code:
A
Abstract:

PURPOSE: To accelerate heat dissipation by inclining the inner circumferential face of a heat dissipation hole in the direction of the heat dissipation hole at the position.

CONSTITUTION: The housing 1 is molded of a synthetic resin or made of an iron or aluminum plate, for example. A face 3 inclining in the direction of a heat dissipation hole 2 is formed on the inner circumferential side at the position of the heat dissipation hole 2 by pressing the inner face of the housing 1. Since the heat in the housing 1 flows smoothly in the direction of the heat dissipation hole 2 along the inclining face 3 and the area of inner circumferential face is increased at the position of the heat dissipation hole 2, heat dissipation is accelerated.


Inventors:
MIYAZAKI AKIRA
NARITA TETSUO
Application Number:
JP18198594A
Publication Date:
February 02, 1996
Filing Date:
July 12, 1994
Export Citation:
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Assignee:
TUNER KK
International Classes:
H05K5/02; H05K7/20; (IPC1-7): H05K5/02; H05K7/20
Attorney, Agent or Firm:
Shunji Ouchi