Title:
【発明の名称】長い走査アレーに使用する撮影素子チップを製造する方法
Document Type and Number:
Japanese Patent JPH0834197
Kind Code:
B2
Abstract:
A process for forming individual dies (5) having faces that allow the dies to be assembled against other like dies to form one and/or two dimensional scanning arrays wherein the active side of a wafer is etched to form small V-shaped grooves (34) defining the die faces, relatively wide grooves (40) are cut in the inactive side of the wafer opposite each V-shaped groove, and the wafer cut by sawing along the V-shaped grooves, the saw being located so that the side (62) of the saw blade (80) facing the die is aligned with the bottom of the V-shaped groove so that there is retained intact one side (35) of the V-shaped groove to intercept and prevent cracks and chipping caused by sawing from damaging the die active surface and any circuits thereon.
Inventors:
Joseph E. Jedricka
Kimberly Earl Page
Allen Y Perigo
Fred F Will Cusack Jr.
Kimberly Earl Page
Allen Y Perigo
Fred F Will Cusack Jr.
Application Number:
JP20622588A
Publication Date:
March 29, 1996
Filing Date:
August 19, 1988
Export Citation:
Assignee:
Xerox Corporation
International Classes:
B28D5/00; B27G19/10; F28D5/00; H01L21/301; H01L21/304; H01L21/306; H01L27/148; (IPC1-7): H01L21/301; B28D5/00; H01L21/306; H01L27/148
Domestic Patent References:
| JP6235642A | ||||
| JP61267343A | ||||
| JP6167243A |
Attorney, Agent or Firm:
Minoru Nakamura (7 outside)
Next Patent: AUTOMATIC LEAD-FEED PENCIL