Title:
WATER-BASED CONDUCTIVE COATING MATERIAL
Document Type and Number:
Japanese Patent JPH083486
Kind Code:
A
Abstract:
PURPOSE: To provide a safe water-based conductive coating material reduced in deterioration of conductivity and being excellent in storage stability.
CONSTITUTION: This material is one prepared by dispersing an electrolytic copper powder having a specific surface area of 2000-10000cm2/g as determined by the BET method, a content of particles passing a 44μm sieve of 90wt.% or above and an oxygen content of 0.2wt.% or below or a copper powder formed by dis-integratring the above hydrolytic copper powder in a water-based polyurethane resin essentially consisting of an organic poly-isocyanate compound and a carboxylic polyol compound.
Inventors:
YOSHITAKE MASAYOSHI
MORIKAWA KAZUMASA
HIRATA FUMIAKI
MORIKAWA KAZUMASA
HIRATA FUMIAKI
Application Number:
JP16308094A
Publication Date:
January 09, 1996
Filing Date:
June 20, 1994
Export Citation:
Assignee:
FUKUDA METAL FOIL POWDER
TAKEDA CHEMICAL INDUSTRIES LTD
TAKEDA CHEMICAL INDUSTRIES LTD
International Classes:
C09D5/24; C09D175/00; C09D175/04; H01B1/22; (IPC1-7): C09D5/24; C09D175/04; H01B1/22
Attorney, Agent or Firm:
Junichi Ando
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