Title:
【発明の名称】無機酸化物研磨材粒子のスラリー及び銅含有表面の研磨方法
Document Type and Number:
Japanese Patent JP2003531502
Kind Code:
A
Abstract:
Oxidizing agents are added to slurries of inorganic oxides which have been heated, e.g., autoclaved, to produce abrasive slurries which impart relatively equal polishing rates for conductive metal and insulating layers used to make semiconductor chips. A relatively flexible abrasive slurry in terms of its abrasivity is also provided by this slurry, thereby permitting the modification of a copper polishing slurry's abrasivity when a new insulating material is used to make a chip. When using this method, an increase in particle abrasivity of this slurry can be correlated with a decrease in particle surface area as determined by N2 adsorption (BET method) and abrasivity can be increased (or decreased) by heating the slurry to produce particles with a surface area determined to have the abrasivity desired. The method is particularly suitable for preparing silica-based abrasive slurries and the slurries prepared are particularly useful for polishing chips made with copper conductive circuits and silica-based insulating layers.
Inventors:
Pryor, James Neil
Application Number:
JP2001578567A
Publication Date:
October 21, 2003
Filing Date:
April 11, 2001
Export Citation:
Assignee:
W R GRACE & CO-CONN
International Classes:
B05D7/00; C09D163/00; C09G1/02; B24B37/00; C09K3/14; H01L21/304; H01L21/321; (IPC1-7): H01L21/304; B24B37/00; C09K3/14
Attorney, Agent or Firm:
Kazuo Shamoto (4 outside)