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Title:
【発明の名称】多層製造物及びその製造プロセス、並びに金属状粒子の形成を最小限にするためのプロセス
Document Type and Number:
Japanese Patent JP2817130
Kind Code:
B2
Abstract:
The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate. In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation. A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.

Inventors:
Elef Zelios Adamopoulos
Yungir Kim
Kang-Wukley
Tae Sun
Terence Robert O'Toole
Sampas Purshottaman
John James Lithosco
Jane Margaret Show
Alfred Viebec
George Frederick Walker
Application Number:
JP26425492A
Publication Date:
October 27, 1998
Filing Date:
September 07, 1992
Export Citation:
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Assignee:
International Business Machines Corporation
International Classes:
B32B15/08; B32B15/088; B32B27/00; B32B7/10; C08G73/00; C08G73/10; H01B3/30; H01L21/52; H05K1/03; H05K3/46; (IPC1-7): C08G73/00; B32B27/00; H01L21/52
Domestic Patent References:
JP58157190A
JP505348A
Other References:
【文献】米国特許4871619(US,A)
【文献】米国特許4654223(US,A)
Attorney, Agent or Firm:
Kiyoshi Goda (2 outside)



 
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